| 摘要 |
PROBLEM TO BE SOLVED: To realize low cost and miniaturization by providing a recess part which is formed at a part opposed to the center part of a patch electrode and will not include a conductor layer inside. SOLUTION: A dielectric substrate 10 is formed of a general dielectric material, and a ground electrode 11 and a patch electrode 12 are formed by patterning metallic conductor layers made of copper, silver, etc., on the rear side surface and the front surface of the substrate 10. A recessed part is formed on the rear side surface of the substrate 10, which is at a position opposed to the center part of the electrode 12. On its bottom surface and side surface, a conductor layer is not formed to expose a dielectric and its inside is made a hollow state where any conductor material will not exist. On the rear side surface of the substrate, capacitance at a recess part is reduced by providing the part 13 which never includes conductor material inside, at a position opposed to the center part of the electrode 12 positioned on an axial line along the flowing direction of current. By reducing the size of the center part, miniaturization becomes possible.
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