| 摘要 |
PROBLEM TO BE SOLVED: To enhance heat dissipation effect by placing an n-th heat transfer plate making surface contact with an IC having highest profile and having a hole penetrating another IC on a board mounting a plurality of ICs of different profile and bringing a heat sink into surface contact with the upper part of first through n-th heat transfer plates. SOLUTION: Heat transfer plates 47, 49, 51 having through holes 45, 46, 48 are placed tightly between a board 44 and a heat sink 52 and brought into surface contact with the surface of a plurality of ICs having highest profile 41, high profile 42 and highest profile 43. It is constituted of a third heat transfer plate (n-th heat transfer plate) 51 formed planarly and having no through hole provided, at at least three ends thereof, with legs 50a-50c being engaged with the board 44, and a heat sink 52 touching the entire surface area thereof. The heat transfer plates 47, 49, 51 and the heat sink 52 are assembled in the order of the third heat transfer plate 51, the second heat transfer plate 49 and the first heat transfer plate 47 while making surface contact with each other.
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