| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device capable of reducing the production cost. SOLUTION: A semiconductor integrated circuit board includes a semiconductor integrated circuit chip 1, an interposer jointed electrically to the semiconductor integrate circuit chip 1, and a package substrate 5 jointed electrically to the interposer. In this case, the number of wiring layers on the semiconductor integrate circuit chip 1 is reduced, and the function of the wiring layer is transferred to the interposer 3.
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