| 摘要 |
PURPOSE: A multichip module packaging process for known good die burn-in is provided to improve a process for packaging an integrated circuit in a multichip module. CONSTITUTION: The method includes the steps of coupling a first integrated circuit die to a substrate, a step for encapsulating the first integrated circuit die, a step for conducting a test on the first integrated circuit die and a step for coupling a second integrated circuit die to the substrate, when the test of the first integrated circuit die is successful. The second integrated circuit may also be tested after encapsulation. The method may also be practiced by encapsulating and testing lesser value die before encapsulating higher value die. This reduces the chance that a higher value die will be rendered unusable because one of the lower value dies attached to the substrate is subsequently found defective after the higher value die has been encapsulated and/or tested. |
