COUPLING METHOD AND COUPLING APPARATUS FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE: A coupling method and coupling apparatus for printed circuit board(PCB) is provided to increase yield rate of product and reduce cost by re-utilizing substrate sheet in an easy and convenient manner. CONSTITUTION: An apparatus comprises a substrate location determining unit(12) having a substrate mounting jig(10) which accommodates a plurality of circuit pattern sections(2a,2b) fixed in the substrate mounting jig; a substrate fixing unit(11) for fixing the non-defective circuit pattern section(2b) integrally to the substrate mounting jig so as to prevent movement of the non-defective circuit pattern section(2b) which is inserted, through a connection section, to a PCB(3); and an adhesion member which fills the space between the PCB fixed to the substrate mounting jig and the non-defective circuit pattern section so as to coupled the PCB and the non-defective circuit pattern section.