APPARATUS FOR WET-ETCHING WAFER USED IN MANUFACTURING SEMICONDUCTOR

摘要

PURPOSE: An apparatus for wet-etching a wafer used in manufacturing a semiconductor is provided to eliminate the need for a wafer guide and to rapidly exhaust the wafer, by making the wafer soaked in buffered oxide etching(BOE) solution while the wafer is held by a robot. CONSTITUTION: A wafer is processed in a process chamber(300). A buffered oxide etching(BOE) solution supplying line(230) supplies BOE solution into the process chamber. A heat exchanger(250) controls the temperature of the process chamber, disposed in a lower portion of the process chamber. A robot guides the wafer into the process chamber, and continuously holds the wafer while the wafer is soaked in the BOE solution of the process chamber.