METHOD FOR PERFORMING SEMICONDUCTOR WET PROCESS FOR PREVENTING PARTICLES AND APPARATUS FOR PERFORMING WET PROCESS USING THE SAME

摘要

PURPOSE: A method for performing a semiconductor wet process for preventing particles is provided to prevent particles from being adhered to a wafer by electrostatic force during a wet process. CONSTITUTION: A cassette(20) on which a wafer is mounted is positioned in an orient flat zone. Ions are generated in the cassette to reduce electrostatic force on the wafer so that particles are prevented from being adhered to the wafer. A roller(30) is transferred from a lower portion of the cassette to be closely adhered to the flat zone of the wafer. The roller is revolved to rotate the wafer while a semiconductor wet process is performed. The ion generation is stopped when the wafer is disposed in the position of the flat zone while descending the roller.