CHEMICAL MECHANICAL POLISHING APPARATUS FOR SEMICONDUCTOR WAFER

摘要

PURPOSE: A chemical mechanical polishing(CMP) apparatus for a semiconductor wafer is provided to prevent erosion of a disc head, by preventing contaminant mixed with slurry and deionized water from penetrating the disc head of a pad conditioner in a cleaning process using deionized water of high pressure. CONSTITUTION: A pad conditioner disc head part(48) polishes a wafer settled on a pad, and moves to a clean cup(40) for an interval of time to clean contaminant on the pad after the polishing process and stands by. A cleaning unit sprays deionized water of high pressure to the wafer to clean the contaminant on the pad after the polishing process. A clean cup guide(50) prevents mixture liquid of the deionized water and the contaminant reflected from the pad from penetrating the pad conditioner disc head part standing by in the clean cup. A clean cup guide driving unit(46) transfers the clean cup guide to a position intercepting an inlet of the pad conditioner disc head part or transfers the clean cup guide from the position to another position.