发明名称 WIRING BOARD AND METHOD OF MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board, and a method of manufacture, in which a composite coaxial through hole conductor can be reduced in size. SOLUTION: The wiring board 1 comprises a composite coaxial through hole conductor 5 including an outer through hole conductor 8 having a central axis 9 penetrating a central board 2 between the major surfaces thereof, and a central conductor 16 disposed inside the outer through hole conductor 8 substantially coaxially thereto. The wiring board 1 further comprises first and second via conductors 26, 27 formed, respectively, in the first resin insulation layer 3 on the central board 2 a second resin insulation layer 4 and connected with the central conductor 16 on the central axis 9.
申请公布号 JP2001127439(A) 申请公布日期 2001.05.11
申请号 JP19990305174 申请日期 1999.10.27
申请人 NGK SPARK PLUG CO LTD 发明人 KURODA MASAO;NISHIURA KOJI
分类号 H05K1/11;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/11
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