| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board, and a method of production, having a high reliability of connection in which the internal length of wiring can be shortened. SOLUTION: Through holes 36 are made through a core board 30 and a lower interlayer resin insulation layer 50 and via holes 66 are made immediately above the through holes 36. Since the through hole 36 and the via hole 66 are straight, the wiring length is shortened and the transmission rate of signal can be increased. Furthermore, connection reliability is enhanced because the through hole 36 is connected directly with the via hole 66 being connected with a solder bump 76 (conductive connection pin 78). |
