| 摘要 |
PROBLEM TO BE SOLVED: To prevent the impedance mismatching of signal wiring between a group of parallel wiring at the surface side of a substrate and a group of parallel wiring at the inner side of the substrate in a multilayer wiring board having a group of parallel wiring. SOLUTION: The multilayer wiring board is provided with a lamination wiring body where a second insulation layer I2 with a second group of parallel wiring L2 including signal wiring S2 orthogonally crossing a first group of parallel wiring L1 is laminated on a first insulation layer I1 with the first group of parallel wiring L1 including signal wiring S1, and the first and second groups of parallel wiring L1 and L2 are electrically connected by a group of feedthrough conductors while the first or second group of parallel wiring L1 and L2 opposes a substrate surface via a third insulation layer I3. In the multilayer wiring board, a thickness t2 of the wiring layer of the second group of parallel wiring L2 opposing the substrate surface is set wider than a thickness t1 of the wiring layer of the first group of parallel wiring L1 that does not oppose the substrate surface. |
