ADHESIVE AND METHOD FOR REMOVING PART BONDED BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain an adhesive capable of ensuring a constant adhesive strength, relatively readily removing a bonded part and bonding a new part again without any problems. SOLUTION: This adhesive is obtained by including a thermosetting resin, a curing agent and an inorganic filler in order to regulate the coefficient of thermal expansion and a thermoplastic resin and regulating the glass transition point to 100-170 deg.C in a thermosetting type adhesive. An acrylic resin or a polyether sulfone is used as the thermoplastic resin and the amount thereof added is 3-150 pts.wt. based on 100 pts.wt. of the thermosetting resin. A fatty type epoxy resin or a blend thereof with a bisphenol type epoxy resin is preferably used as the thermosetting resin. A fatty type epoxy resin having 200-100 cP viscosity at 25 deg.C is used as the fatty type epoxy resin. The method for removing the part bonded with the adhesive is provided by applying a load to the adhesive in a state thereof heated at, e.g. 100-170 deg.C.