| 摘要 |
PROBLEM TO BE SOLVED: To produce an electroless plating bath capable of depositing a film to form into a barrier metal layer uniformly and also at a film deposition rate higher than the conventional case even in wiring and connecting holes fined or whose aspect ratio is made high and to provide a method for depositing an electrically conductive film using the same. SOLUTION: In a process in which an electrically conductive film to form into a barrier metal layer 31 is deposited on the inner walls of fined grooves (G1, G2) for wiring and of a conduct hole C2, the surface to be plated is subjected to activating treatment, and after that, using an electroless plating bath at least containing a first metallic material feeding the essential components in the electrically conductive film, a second metallic material feeding components imparting barrier metal function to the electrically conductive film, a first complex of an amphoteric ionic type, a second complex promoting plating reaction, a reducer and a pH conditioner, and whose pH is controlled to the range from neutrality to alkalinity, the electrically conductive film is deposited.
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