SUBSTRATE FOR MULTIPLE-PIN BALL GRID ARRAY PACKAGE, MULTIPLE-PIN BALL GRID ARRAY PACKAGE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the wiring density of the packaging region of a multiple-pin BGA without increasing the number of layers of an entire packaging substrate. SOLUTION: A path (wiring) 7 for connecting external electrodes (pins) without directly making connection to a chip 10 to be mounted is provided within a substrate 1 for BGA. The semiconductor device is obtained by mounting only the substrate for GBA or a BGA where electronic parts are mounted to the substrate to a packaging substrate without increasing the number of wiring layers of the packaging substrate.