发明名称 DEVICE AND METHOD FOR HEATING TREATMENT
摘要 PROBLEM TO BE SOLVED: To provide a heating treatment device, with which the temperature of a hot plate can be elevated/lowered at high speed in comparison with a conventional heating treatment device. SOLUTION: Inside a post-exposure baking device 44, a hot plate 70 composed of aluminum nitride improved in heat conductivity and strength is provided and this hot plate 70 is heated by a heater 71 printed on the lower surface thereof. A support 65 composed of PTFE improved in heat insulation supports the entire periphery of the hot plate 70 in tight contact to the hot plate 70. Further, a nozzle 74 is provided inside a heat exchange chamber T formed under the hot plate 70, and when lowering the temperature of the hot plate 70, a gas for cooling is blown to the back of the hot plate 70.
申请公布号 JP2001168022(A) 申请公布日期 2001.06.22
申请号 JP20000291712 申请日期 2000.09.26
申请人 TOKYO ELECTRON LTD 发明人 TAGAMI MITSUHIRO;ODA TETSUYA
分类号 F26B3/20;B01J19/00;F26B9/06;F26B23/06;F27D7/06;F27D9/00;G03F7/30;H01L21/027;H05B3/10;H05B3/16;H05B3/20;H05B3/68;(IPC1-7):H01L21/027 主分类号 F26B3/20
代理机构 代理人
主权项
地址