| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, with which a polyimide film can be made usable as a component of a chip by improving adhesion between the polyimide film and a metal film. SOLUTION: In this method of manufacturing semiconductor device, a film 4 containing hexamethyldisilazane is interposed between the polyimide film 3 and an aluminum film 2, as shown in fig. (d). Consequently, direct reaction of the aluminum film 2 to water can be inhibited, and in addition, adhesion between the polyimide film 5 and film 4 is improved, resulting in the suppression of the occurrence of peeling and corrosion. In addition, the polymide film 5 can be utilized as a component of a chip.
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