Polishing composition

摘要

[Problem] Provided is a polishing composition that can sufficiently maintain a high polishing rate for a barrier layer and an insulating film and suppress the occurrence of a surface defect such as erosion or fang.;[Solution] Provided is a polishing composition which is used in the application to polish a polishing object having a barrier layer, a metal wiring layer and an insulating film, the polishing composition including abrasive grains, an oxidant, a metal corrosion inhibitor, a pH adjusting agent and water, in which an aspect ratio of abrasive grains is 1.22 or less and a ratio D90/D10 of a diameter D90 of particles when a cumulative particle weight from the fine particle side reaches 90% of the total particle weight to a diameter D10 of particles when the cumulative particle weight from the fine particle side reaches 10% of the total particle weight of the entire particles is 1.5 or more in a particle size distribution of the abrasive grains determined by a laser diffraction scattering method.

主权项

1. A polishing composition used in polishing a polishing object having a barrier layer, a metal wiring layer and an insulating film, the polishing composition comprising:
abrasive grains; an oxidant; a metal corrosion inhibitor; a pH adjusting agent; and water, wherein an aspect ratio of the abrasive grains is 1.22 or less and more than 1.0, a ratio D90/D10 of a diameter D90 of particles when a cumulative particle weight from a fine particle side reaches 90% of a total particle weight to a diameter D10 of particles when the cumulative particle weight from the fine particle side reaches 10% of the total particle weight of the entire particles is 1.5 or more and 3.0 or less in a particle size distribution of the abrasive grains determined by a laser diffraction scattering method.