发明名称 |
PROCESS FOR PLANARIZATION AND RECESS ETCHING OF POLYSILICON IN AN OVERFILLED TRENCH |
摘要 |
The invention is directed to a process for forming a recess in at least one poly silicon overfilled trench in an integrated circuit, comprising the following steps: uniformly etching the poly silicon overfill layer (4); stopping the etching before the poly silicon layer (4) is completely removed from the surface of the integrated circuit; and recess etching the polysilicon layer (4) with microtrenching properties for forming a substantially planar recess (6) near the top of the at least one trench (3). |
申请公布号 |
WO0161739(A1) |
申请公布日期 |
2001.08.23 |
申请号 |
WO2001EP00715 |
申请日期 |
2001.01.23 |
申请人 |
SEMICONDUCTOR300 GMBH & CO. KG;MORGENSTERN, THOMAS |
发明人 |
MORGENSTERN, THOMAS |
分类号 |
H01L21/02;H01L21/321;H01L21/3213;H01L21/763 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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