发明名称 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND PORTABLE INFORMATION TERMINAL
摘要 A low cost semiconductor device, a method of manufacturing an electronic device, electronic devices, and a portable information terminal; the semiconductor device, comprising projected electrodes located on one surface of a circuit board and having a specified height, semiconductor chips smaller than the height of the projected electrodes, and electronic parts larger than the thickness of the semiconductor chips located on the other surface of the circuit board so that the one surface side is bent in the direction thereof, whereby the rigidly of the device and a clearance between the semiconductor chips and a mounting substrate are assured; electronic devices and a portable information terminal, wherein the semiconductor device having a logic LSI installed on both surfaces of the circuit board is installed on a mounting substrate disposed in a cabinet through the projected electrodes having a specified height and formed so that the projected electrode side of the circuit board is bent in the direction thereof, whereby the rigidity and clearance can be assured and a damage is not given to the logic LSI even when an external pressure is applied thereto.
申请公布号 WO0171806(A1) 申请公布日期 2001.09.27
申请号 WO2001JP02171 申请日期 2001.03.19
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA;HAMAGUCHI, TSUNEO;KAGATA, KENJI 发明人 HAMAGUCHI, TSUNEO;KAGATA, KENJI
分类号 H01L23/13;H01L23/498;H01L25/065;H01L27/146;H05K3/34 主分类号 H01L23/13
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