发明名称 SOLDER CHIP
摘要 PROBLEM TO BE SOLVED: To provide a solder chip in which solder is quantified while a conventional process is made use of and which can stably be mounted. SOLUTION: The solder chip for jointing electric parts to a printed board is provided with a chip main body 2 having a plane part and projecting parts 4 which are formed on the solder chip main body 2, so that they protrude from the plane part and are engaged with the printed board or a soldering land 1 on the printed board.
申请公布号 JP2001298264(A) 申请公布日期 2001.10.26
申请号 JP20000115517 申请日期 2000.04.17
申请人 CANON INC 发明人 SHIMIZU ICHIRO
分类号 B23K35/14;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K35/14
代理机构 代理人
主权项
地址