| 摘要 |
PROBLEM TO BE SOLVED: To inhibit increase in costs and man-hour in a sealing process in the facedown package of an IC, to maintain reliability, and at the same time to increase the filling property of sealing resin. SOLUTION: An insulation coating 4 slit 4 is formed slightly outside the four corners of an IC chip 3 that is packaged onto a flexible substrate l. The sealing resin flows into an insulation coating window 2 via the insulation coating slit 4 after coating, and is smoothly filled into the clearance between the periphery of the IC chip 3 and the flexible substrate 1 and the periphery of the IC chip 3. |
