| 摘要 |
PURPOSE: To provide a thermal infrared sensor with high freedom of structure and low cost and its production method. CONSTITUTION: In the upper part of a plate shape space formed inside a semiconductor substrate, an infrared detector and support legs are formed. On the semiconductor substrate, a circuit for processing signals from the detector is installed. With this method, the characteristic improves because the structure of the circuit for processing is not affected by the substrate structure. Owing to the simple structure, a production cost can be reduced.
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