| 摘要 |
A method used in fabricating processes of display modules with various sizes for checking positions of tape automated bonding (TAB) regions on said display modules is provided. The method includes steps of providing a main holder having a holding panel with a size sufficient for suiting the display modules, providing at least two test plates, wherein the test plates and the holding panel have the same peripheral sizes, and the test plates respectively have a hollow portion for suiting the display modules, providing two circuit plates respectively disposed around the first and second hollow portions for suiting the positions of the tape automated regions, and selecting a test plate having a suitable hollow portion for a specific circuit plate and a display module with a specific size in the fabricating process of the display module with the specific size.
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