发明名称 POLYAMIDE RESIN COMPOSITION AND PACKAGING FILM COMPOSED THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition which has excellent blocking resistance, transparency and melt stability and can stably provide films having good surface appearance, and to provide a packaging film composed thereof. SOLUTION: The polyamide resin composition comprises silica, and the polyamide resin having an equivalent amount (X) (μeq/g resin) of the terminal amino group (-NH2), an equivalent amount (Y) (μeq/g resin) of the terminal acylamino group [-NHCO-R1 (wherein R1 is a 1-24C hydrocarbon group)], and an equivalent amount (Z) (μeq/g resin) of the terminal carboxyl group (-COOH) which meet the relation ships represented by formula (I): 0.2<=Y/(X+Y) and formula (II): 0.5<=Z/X<=1.5, and the packaging film is composed of the composition.
申请公布号 JP2001342343(A) 申请公布日期 2001.12.14
申请号 JP20000163894 申请日期 2000.06.01
申请人 MITSUBISHI CHEMICALS CORP 发明人 MIYAMOTO MASAAKI;YAMAMOTO MASANORI
分类号 B65D65/02;C08J5/18;C08K3/36;C08K9/06;C08L77/02;(IPC1-7):C08L77/02 主分类号 B65D65/02
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