| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-wiring board using a metal foil-clad resin com pound ceramics plate where at least two metal foil-clad resin compound ceram ics plates are mutually bonded at the side. SOLUTION: In this method of manufacturing a printed-wiring board using a metal foil-clad resin compound ceramics plate (II), an impregnation sintering substrate (IR) where an inorganic continuation pore sintering substrate (I) is impregnated with curing resin (R) and metal foil are laminated for forming. An assembly plate (MII) where at least two impregnation sintering substrate (IR) are mutually bonded by the contact side is arranged and manufactured as the compound ceramics plate (II) without separating to each compound ceramics plate (II). Printed-wiring net is formed collectively. Also, a method for manufacturing multilayered boards uses the printed-wiring board, thus manufacturing the printed-wiring net in a large size and forming it in multiplayer, drastically relaxing lamination in terms of manufacturing operation due to a small work size, effectively utilizing existing production facilities, and further using a small printed-wiring board that has not been used due to problems for securing a work region. |
