| 摘要 |
<p>PURPOSE: A heater block used in a process for manufacturing a semiconductor package is provided to improve bonding reliability while reducing power, force and time in a stitch bonding process, by forming a protrusion in an outer region of a down-set surface of the heater block so that the tip of a lead is lifted up. CONSTITUTION: The heater block(1) has the down-set surface(100) where the die pad of a leadframe is settled, in its center. The heater block includes a region where the lead(2) is located in the outer portion of the down-set surface. The protrusion(102) is installed in the outer region of the down-set surface to lift up the tip portion of the lead.</p> |
