| 摘要 |
PURPOSE: A semiconductor package is provided to maximize heat radiation of a semiconductor chip, by using a thin member like a circuit film, a printed circuit board and conductive ink so that the semiconductor chip is exposed to the exterior and the size and thickness of the semiconductor package is reduced. CONSTITUTION: Glass(12) is of a predetermined size. A member including a conductive material for input and output is adhered to the glass by using an adhesion element. The semiconductor chip(24) is adhered along the conductive material exposed to the edge of the inner portion of the member by a bumper melting. A plurality of withdrawal terminals(26) are adhered to the conductive material exposed to the member near the semiconductor chip. |
