| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering apparatus which has simple structure, reduces cost, and simulates the temperature profile in a reflow section to flatten the profile so that lead-free cream solders can be used for global environment conversation. SOLUTION: A reflow section 12 has a hot-air blowing member 24 in order to blow out hot-air HW to solder regions on a first surface 310 of a printed circuit board P. A total opening area of a plurality of first openings 24a is set to larger than the total opening area of a plurality of second openings 24b, where the first openings 24a and the second openings 24b are formed at a front half area 400 and a latter half area of the hot-air blowing member 24, respectively, to blow out the hot-air HW in the direction T to the printed circuit board P at the reflow section 12. |
