| 摘要 |
PROBLEM TO BE SOLVED: To provide a film carrier of which the bonding leads are easily broken in the bonding process and are not broken or bent in the other manufacturing processes. SOLUTION: The film carrier 1 constituted of insulation film 2 and a metal foil (copper foil 5), at least, has the bonding lead 7 for joining electrode 14 of a mounting electronic component, and bonding lead 7 has half-etched portion 11 in the width direction. Hereby, since the bonding lead 7 is easily broken by moving a bonding tool 24 downward and, descending speed of the bonding tool 24 is made smooth. Therefore, it is possible to prevent an occurrence of operational failures of IC chip 30 due to overweight when a bonding portion, bump 13, and electrode 14 are bonded. |
