| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip, by which the stacked semiconductor package can be miniaturized, a small-sized stacked semiconductor package and their manufacturing method. SOLUTION: The stacked semiconductor package 30 is provided with a stacked body 32 provided by stacking a plurality of the semiconductor chips 10 having an electrode on the side, a package board 36 having the number of soldering balls 34 corresponding to an electrode on the other face, and an electrode connection wire 40 extended on the side 38 of the stacked body, connecting the electrodes corresponding to the semiconductor chip and connected to the corresponding soldering balls 34. Thereby the same degree of the small- sized stacked semiconductor package as the semiconductor chip in the size of the lateral direction of the stacked semiconductor package is realized. |
