RESIN COMPOSITION FOR SEMICONDUCTOR SEALANT, SEMICONDUCTOR DEVICE USING THE SAME AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for a semiconductor sealant excellent in moisture resistant reliability and storage stability as well as excellent in discharge and coating workability. SOLUTION: This resin composition for the semiconductor sealant contains the (A)-(C) components. A viscosity of the resin composition for the semiconductor sealant is prepared as 200 Pa.s or less at 25 deg.C, or is prepared as 200 Pa.s or less at 80 deg.C furthermore is a solid state at 25 deg.C. (A) an epoxy resin (B) an acid anhydride curing agent (C) a latent curing accelerator.