| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling module in which cooling efficiency can be enhanced through such a structure as no fluid passage is provided on the side of a heat transfer plate. SOLUTION: The cooling module 11 comprises a semiconductor element 15 to be cooled, a planar heat transfer plate 16 having a high thermal conductivity and touching the plane of the semiconductor element, and a fluid cover 18 bonded to the heat transfer plate and having a fluid passage. Since the heat transfer plate 16 is planar, material thereof can be selected by attaching importance only to the thermal conductivity and thereby heat transfer action is enhanced. Since a fluid passage is provided on the fluid cover 18 side, degree of freedom is increased in the selection of such material and manufacture as various fluid passages can be formed while attaching importance only to the heat exchanging action of fluid resulting in the enhancement of cooling effect. |
