| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive power module exhibiting excellent heat dissipation properties in which high reliability is sustained even if thermal stress is applied repeatedly during actual use. SOLUTION: Onto a heat sink having a surface of Cu or Cu alloy or Al or Al alloy, a ceramic circuit board having an Al circuit firmed on the surface of a ceramic substrate and a metal plate formed on the backside thereof is bonded through a soldering material such that the soldering material touches the metal plate and an electric component is bonded onto the Al circuit through solder. In such a power module, the solder is an Sn-Pb based solder containing 45-85 mass% of Pb. |
