MULTILAYER PRINTED-WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed-wiring board that is manufactured by a reliable build-up process for preventing cracks from being generated in an insulating layer and a solder resist layer when the printed-wiring board is used for electronic equipment. SOLUTION: In the multilayer printed-wiring board, a solder resist layer for covering the wiring layer of a printed-wiring board that is manufactured by the build-up process is formed, and at least 1 cm2 polygonal flat pattern is formed on the wiring layer. The multilayer printed-wiring board should have at least one nearly semi-circular flat pattern protrusion 13 or a flat pattern recess 14 with a radius of 500μm or more per cm2 at a side where the length of the side of the flat pattern is 1 cm or longer.