| 摘要 |
PROBLEM TO BE SOLVED: To realize a power branch and combination device capable of performing multi-layer interconnection and simplification of a circuit. SOLUTION: The power branch and combination device consists of a first and a second dielectric substrates 10 and 20 arranged so as to face each other, a grounding conductor plate 22 sandwiched between the first and the second dielectric substrates 10 and 20, a joining slot which is an opening 18 formed on the ground conductor plate 22, a first high frequency transmission line 12 arranged on the first dielectric substrate 10, and a second and a third high frequency transmission lines 14 and 16 arranged on the second dielectric substrate 20. The first, the second, and the third high frequency transmission lines, 12, 14 and 16 are arranged so as to be orthogonal to the joining slot 18, and power is branched or combined through the joining slot 18.
|
