| 摘要 |
A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming a first bump on the bonding pad, forming a photoresist layer on the pad-mounting surface, forming a second bump which protrudes from the first bump through an upper surface of the photoresist layer, and forming a conductive body on the second bump. The conductive body has an anchor portion connecting electrically with and encapsulating an upper portion of the second bump, and a contact portion offset from the anchor portion and adapted to be connected to a substrate.
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