发明名称 FLEXIBLE PRINTED-WIRING BOARD, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a flexible printed-wiring board that can form fine wiring, has a wiring pattern near the center in a thickness direction, and can obtain a contact for connection from both the front and rear. SOLUTION: The wiring pattern 3 is formed by electrolytic plate with a metal plate 1 as a lead for electrolytic plating, an insulating resin 4 is formed on it, an opening 5 is formed at an insulating covering so that the wiring pattern is exposed partially. The metal plate is removed by etching, the insulating covering 4 is formed also on a surface where the metal plate is removed, and an opening is formed also on the insulating covering.
申请公布号 JP2002141640(A) 申请公布日期 2002.05.17
申请号 JP20000331234 申请日期 2000.10.30
申请人 SUMITOMO BAKELITE CO LTD 发明人 OKUGAWA YOSHITAKA;ITO SHINICHIRO;KATO MASAAKI;SAWAI HIROYUKI
分类号 H05K3/28;H05K1/02;H05K3/18;H05K3/20;(IPC1-7):H05K3/20 主分类号 H05K3/28
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