| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively provide a reliable ceramic circuit board with superior heat radiation properties, and to provide a module structure body. SOLUTION: In this ceramics circuit board, a circuit made of Al is provided on the surface of a ceramics substrate, and a soldering layer containing Sn and Zn is provided at least at one portion of the surface of the circuit. In this case, the soldering layer preferably contains 5 wt.% or more and 96 wt.% or less Sn, and 0.05 wt.% or more and 30 wt.% or less Zn. This module structure body uses the ceramics circuit board.
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