SUBSTRATE PROCESSING APPARATUS, SUBSTRATE INSPECTING METHOD, AND SUBSTRATE PROCESSING SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and substrate inspecting method, which can suitably inspect a substrate while suppressing reduction of its throughput. SOLUTION: An inspection unit 30 is provided within a substrate processing apparatus which performs resist coating and developing operations over a substrate. The inspection unit 30 includes a film thickness measuring instrument 32, a linewidth measuring device 33, an overlap measuring device 34, and a macro defect inspecting device 35. These elements are positioned as laminated in this order from its bottom. The inspection unit 30 is provided in the course of a substrate transfer path formed in a substrate processing apparatus. The substrate to be processed in the substrate processing apparatus is selectively transported in each inspection part. Accordingly, the substrate can be inspected appropriately as necessary in the apparatus and the substrate inspection can be suitably realized while suppressing reduction of its throughput.