| 摘要 |
A lead frame has an array of mounting portions connected by joint bars, and each of the mounting portions has an island serving as an external connection terminal and a plurality of lead terminals extending from the island and serving as external connection terminals for a semiconductor chip to be mounted on an adjacent island along the array. An electrically conductive paste is applied to the island, and a semiconductor chip is mounted on the island. Then, the semiconductor chip is electrically connected to the lead terminals by wires. A resin layer is deposited over the semiconductor chip, a principal surface of the island, and principle surfaces the lead terminals, while leaving opposite surfaces of the island and the lead terminals exposed. A region surrounding the island and the lead terminals electrically connected to the island is cut off into a package.
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