发明名称 |
Wire and solder arrangement of ease of wave soldering |
摘要 |
The invention relates to an electrically conductive wire (1) comprising two spaced solder balls (2) thereon and flux (4) in the space (3) between the solder balls for making a circuit connection between electrically conductive members on opposite surfaces of a substrate. The wire (1) is inserted in a through-hole of the substrate and soldered by a customary soldering process, like wave soldering.
|
申请公布号 |
US6410854(B1) |
申请公布日期 |
2002.06.25 |
申请号 |
US19960752865 |
申请日期 |
1996.11.20 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
VANHOUTTE EDDY W.;DE CLERCQ GILBERT |
分类号 |
H01R11/01;B23K1/20;B23K31/02;B23K35/14;H01L23/02;H01L23/48;H01R4/00;H01R4/02;H01R12/04;H01R12/32;H01R43/02;H05K1/11;H05K1/18;H05K3/34;H05K3/40;(IPC1-7):H01R43/02 |
主分类号 |
H01R11/01 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|