发明名称 Wire and solder arrangement of ease of wave soldering
摘要 The invention relates to an electrically conductive wire (1) comprising two spaced solder balls (2) thereon and flux (4) in the space (3) between the solder balls for making a circuit connection between electrically conductive members on opposite surfaces of a substrate. The wire (1) is inserted in a through-hole of the substrate and soldered by a customary soldering process, like wave soldering.
申请公布号 US6410854(B1) 申请公布日期 2002.06.25
申请号 US19960752865 申请日期 1996.11.20
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 VANHOUTTE EDDY W.;DE CLERCQ GILBERT
分类号 H01R11/01;B23K1/20;B23K31/02;B23K35/14;H01L23/02;H01L23/48;H01R4/00;H01R4/02;H01R12/04;H01R12/32;H01R43/02;H05K1/11;H05K1/18;H05K3/34;H05K3/40;(IPC1-7):H01R43/02 主分类号 H01R11/01
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