| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing an electronic part of high air- tightness capable of jointing strongly an insulating substrate, metal frame, and lid. SOLUTION: A metal frame 2 whose corners between upper and lower surfaces and a side surface are rounded, R1 and R2, is so brazed to a brazing metallize layer 6 of an insulating substrate 1 which comprises a mounting part 1a where an electronic part 4 is mounted on the upper surface and a frame-like brazing metallize layer 6 which surrounds the mounting part 1a. A metal lid 3 is jointed to the upper surface of the metal frame 2. Related to the metal frame 2, the radius of curvature of the round R1 on the upper surface side is 5-30μm while that of the round R2 on the lower surface side is 40-80μm.
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