COMPOUND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To suppress the warp of a heat sink at the time of assembly to be minimum. SOLUTION: A slit 20 is disposed between insulating boards 13 and 13 which are adjacently placed and fixed on the heat sink 12 used in a compound semiconductor device 1. Stress at the time of basing and at the time of a secular change is relieved with the formation of the slit 20. Warp quantity is relatively reduced, the crack of an insulating substrate is prevented and mechanical stress given to a semiconductor pellet can be reduced.