ELECTRONIC CONNECTION STRUCTURE FOR COUPLING PINS OF CHIP WITH WIRING CIRCUIT AND PANEL USING SAME

摘要

An electronic connection structure includes a first connection portion, a second connection portion, and a connection pad configured to be coupled the first connection portion to the second connection. The connection pad includes a connection layer and at least two conduction layers. The connection layer is configured to be coupled to the first connection portion via anisotropic conductive media. The conduction layers are configured to be coupled the connection layer to the second connection portion. The at least two conduction layers are partially overlapped.

主权项

1. An electronic connection structure, comprising:
a first connection portion; a second connection portion coupled to the first connection portion; a plurality of connection pads formed on a substrate layer and configured to couple the first connection portion to the second connection portion, each connection pad comprising:
a first conduction layer formed on the substrate layer;a first insulation layer covering the substrate layer and the first conduction layer, a first connection hole being defined in the first insulation layer;a second conduction layer formed on the first insulation layer;a second insulation layer covering the first insulation layer and the second conduction layer, a second connection hole being defined in the second insulation layer, the second conduction layer being electrically coupled to the first conduction layer via conductive materials in the first connection hole; anda connection layer formed on the second insulation layer and electrically coupled to the second conduction layer via conductive materials in the second connection hole;the connection layer being to be electrically coupled to the first connection portion by an anisotropic conductive media;the first conduction layer and the second conduction layer configured to cooperate with each other to couple the first connection portion to the second connection portion, wherein the second conduction layer partially overlaps the first conduction layer; andwherein a first border of at least one of the first conduction layer and the second conduction layer is aligned with or extended beyond a first border of the connection layer, and a second border of at least one of the first conduction layer and the second conduction layer is aligned with or extended beyond a second border of the connection layer.