| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive paste and a method for manufacturing a ceramic circuit board capable of bringing the sintered shrinkage phenomenon close to that of a board material, preventing generation of defects such as breaking of wire even when fine-wiring is formed by screen printing, and obtaining a conductor having small resistance. SOLUTION: This conductive paste contains silver powder and an organic vehicle. The silver powder is composed of porous secondary particles 3 having an average particle size of 2-10μm formed by three-dimensional welded bonding of primary particles 1, and the primary particles 1 are preferable to have an average particle size of 0.1-3μm. |
