| 摘要 |
The arrangement has a functional microelectromechanical system-region (M1) i.e. inertial sensor, integrated on a front side (V) of a silicon substrate. Another functional microelectromechanical system-region (M2) i.e. magnetic field sensor, is integrated on a rear side (R) of the substrate. A throughcontact of the former microelectromechanical system-region runs through the substrate to the latter microelectromechanical system-region. Another substrate i.e. cap wafer, is bonded on the front side and/or on the rear sides of the former substrate. An independent claim is also included for a method for establishing a micromechanical sensor arrangement. |
