| 发明名称 |
High performance heat sink for electronics cooling |
| 摘要 |
Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least three fins arranged radially around the spreader plate and an array of porous reticulated foam blocks that fills the space between adjacent fins.
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| 申请公布号 |
US6424531(B1) |
申请公布日期 |
2002.07.23 |
| 申请号 |
US20010888753 |
申请日期 |
2001.06.25 |
| 申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
BHATTI MOHINDER SINGH;JOSHI SHRIKANT M.;JOHNSON RUSSELL S. |
| 分类号 |
F28F3/02;F28F13/00;H01L23/373;(IPC1-7):H05K7/20 |
主分类号 |
F28F3/02 |
| 代理机构 |
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