发明名称 |
Method for removing photoresist layer on wafer edge |
摘要 |
A method for removing a photoresist layer on wafer edge is disclosed. The invention uses a light source located under a spin on coated wafer mounted on a supporting mean of a rotatable chuck to expose the photoresist material on the wafer edge. First of all, the spin on coated wafer is mounted on the supporting mean of the rotatable chuck. Then the rotatable chuck is rotated and the wafer is exposed to the light source. Finally, the wafer is developed.
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申请公布号 |
US2002098709(A1) |
申请公布日期 |
2002.07.25 |
申请号 |
US20010768058 |
申请日期 |
2001.01.24 |
申请人 |
MACRONIX INTERNATIONAL CO., LTD. |
发明人 |
WU I-PIEN |
分类号 |
G03B27/42;G03F7/20;H01L21/302;(IPC1-7):H01L21/302 |
主分类号 |
G03B27/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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