RESIN MOLDING MATERIAL FOR ELECTRONIC PART CLEANING IMPLEMENT AND ELECTRONIC PART CLEANING IMPLEMENT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a molding material in which development of warpage and cracks are suppressed and a residual stress is reduced even at cleaning by ultrasonic cleaning using an organic solvent cleaning agent, and to provide an electronic parts cleaning implement obtained by molding the same requiring a high degree of cleaning such as a magnetic head. SOLUTION: The resin molding material for the electronic parts cleaning implement and the electronic parts cleaning implement obtained by molding the same include a fluororesin, a thermoplastic resin except the fluororesin and a reinforcing filler.