CSP BGA test socket with insert and method

摘要

A BGA test socket for use in standard testing and burn-in testing of BGA dies and method for testing such dies is disclosed wherein a die contact insert made of silicon or ceramic using standard IC fabrication technology is used. Through using such an insert, even small scale (pitch) BGA dies can be reliably tested including chip scale packaged ("CSP") BGA dies. Furthermore, using such an insert allows a conventional socket to be adapted for use with a wide variety of both BGA dies and other varieties. A method for using the device is disclosed which overcomes current static electricity problems experienced in testing CSP BGA dies through closing the test socket before removing the die deposit probe.